Manufacture

Co-packaged optics CPO A comprehensive overview

Co-packaged optics (CPO) – A comprehensive overview

Co-packaged optics (CPO) is an innovative technology that has gained significant attention in electronics and optical communication. This article aims to provide a comprehensive overview of co-packaged optics, highlighting its advantages and applications. Also, I will touch on the technologies required to make it work, challenges you might face along the way, and prominent companies in the industry.

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PCB via - a complete guide for vias in PCB design

PCB via – a complete guide for vias in PCB design

PCB via is a microscopic bridge, facilitating the communication and integration of various circuit elements within the intricate layers of the PCB. This article provides a concise overview of PCB vias, their purpose, types, design rules, sizing considerations, common problems, and differentiation from pads, as well as the best choices in HDI PCB board design.

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Understanding PCB Printing Process, Factors, and Printer Selection

Understanding PCB Printing: Process, Factors, and Printer Selection

This article provides an in-depth overview of PCB printing, including its function, process, and factors that may affect the printing. It also covers the role of PCB printing in the PCB manufacturing process and offers guidelines for selecting the proper printer. Learn about the essential components of PCB printing and make informed decisions for your manufacturing needs.

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